JPS635251Y2 - - Google Patents

Info

Publication number
JPS635251Y2
JPS635251Y2 JP1982041123U JP4112382U JPS635251Y2 JP S635251 Y2 JPS635251 Y2 JP S635251Y2 JP 1982041123 U JP1982041123 U JP 1982041123U JP 4112382 U JP4112382 U JP 4112382U JP S635251 Y2 JPS635251 Y2 JP S635251Y2
Authority
JP
Japan
Prior art keywords
glass
leads
lead frame
lead
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982041123U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58144849U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4112382U priority Critical patent/JPS58144849U/ja
Publication of JPS58144849U publication Critical patent/JPS58144849U/ja
Application granted granted Critical
Publication of JPS635251Y2 publication Critical patent/JPS635251Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP4112382U 1982-03-23 1982-03-23 半導体装置 Granted JPS58144849U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4112382U JPS58144849U (ja) 1982-03-23 1982-03-23 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4112382U JPS58144849U (ja) 1982-03-23 1982-03-23 半導体装置

Publications (2)

Publication Number Publication Date
JPS58144849U JPS58144849U (ja) 1983-09-29
JPS635251Y2 true JPS635251Y2 (en]) 1988-02-12

Family

ID=30052312

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4112382U Granted JPS58144849U (ja) 1982-03-23 1982-03-23 半導体装置

Country Status (1)

Country Link
JP (1) JPS58144849U (en])

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5416388B2 (en]) * 1974-03-27 1979-06-21
JPS5665665U (en]) * 1979-10-25 1981-06-01

Also Published As

Publication number Publication date
JPS58144849U (ja) 1983-09-29

Similar Documents

Publication Publication Date Title
JP2915892B2 (ja) 樹脂封止型半導体装置およびその製造方法
KR100496762B1 (ko) 필름캐리어테이프및반도체장치,이들의제조방법및회로기판
US4560826A (en) Hermetically sealed chip carrier
JPS635251Y2 (en])
KR100431182B1 (ko) 표면 탄성파 필터 칩 패키지 및 그 제조방법
JPS607751A (ja) 半導体装置
US5541451A (en) Packaged semiconductor device with external leads having anchor holes provided at polyamide/glass sealed regions
JPS59117250A (ja) 半導体装置
JPS5998540A (ja) 半導体装置
JPH03161958A (ja) プラスチックピングリッドアレイ型半導体パッケージ構造
JPH0366152A (ja) 半導体集積回路モジュール
JP2753363B2 (ja) 半導体装置
JPS5917270A (ja) 半導体装置
JPS60165742A (ja) 半導体装置
JPH01257361A (ja) 樹脂封止型半導体装置
JPH10144828A (ja) 半導体パッケージ
JP4062445B2 (ja) 半導体装置の製造方法
JPH0582584A (ja) 半導体装置
JP2531445B2 (ja) ガラス封止型icパッケ―ジ
JPH01215049A (ja) 半導体装置
KR970004618Y1 (ko) 패드가 없는 반도체 패키지
JPH02185060A (ja) 半導体装置用リードフレーム
JPS5852855A (ja) キヤツプ接着方法
JPS6240750A (ja) 樹脂封止半導体装置
JPH02105547A (ja) 半導体装置の製造方法